This material is a newly developed high-tech synthetic material with soft texture, low density, high strength, high modulus, and high temperature resistance.
This material is a newly developed high-tech synthetic material with soft texture, low density, high strength, high modulus, and high temperature resistance. It can be used in grinding and polishing fixtures for semiconductor wafer substrates, aluminum-based hard disk substrates, glass-ceramics and other materials. Because of the high strength of the material but the soft texture and certain elasticity, it will not affect the sidewall of the workpiece and cause scratches during the grinding and polishing process. The standard material thickness is 0.40, 0.45, 0.53, 0.60, 0.70, 0.80, 1mm. It can correspond to different processed products and process the corresponding jigs. Other thickness products can also be customized according to customer requirements.
